We offer a comprehensive lineup of packaging materials essential for power module (IGBT/SiC) assembly and packaging, including external housings, interconnect terminals, and cooling heat sinks.
Our portfolio features power module housings (utilizing open-tooling/public molds to significantly eliminate initial mold costs), copper (Cu) pins in straight and press-fit types, various sleeves, and high-dissipation pin fin heat sinks.
Beyond supplying individual components, we specialize in delivering integrated turnkey solutions (Housing + Pins + Heat Sink) from small-lot prototyping to high-volume mass production, ensuring short lead times and a highly stable supply chain.