AMB Substrate
High voltage and high thermal dissipation solutions. Supporting silicon nitride (Si₃N₄) and aluminum nitride (AlN) substrates from initial rapid prototyping to high-volume mass production. 【View Details】
Materials for semiconductors
Comprehensive backend materials including leadframes, epoxy molding compounds (EMC), and consumables. Delivering alternative sourcing options and stable, high-volume supply chains. 【View Details】
Materials for IGBT power module
Portfolio features open-tool housings, copper press-fit pins, and pin fin heat sinks. Available as individual parts or cost-effective turnkey solution kits. 【View Details】
Various manufacturing equipment
Advanced backend equipment including KGD test handlers and automatic wedge bonders. From low-volume evaluation systems to fully automated mass production line integration. 【View Details】
