We offer a comprehensive portfolio of semiconductor materials and consumables essential for IC, discrete, and power device assembly and packaging (backend processes).
Our high-reliability product lineup includes etched and stamped leadframes for high-density packaging, high-performance epoxy molding compounds (EMC), mold cleaning and release sheets (release films) to optimize equipment uptime, and durable leadframe magazines optimized for automated handling systems.
Leveraging our robust global supply network, we flexible support everything from initial prototype evaluations to high-volume mass production with a highly stable, continuous supply chain.also stock a wide variety of other materials.
