Application
Specifically engineered for high-reliability wedge bonding processes, making it ideal for heavy Aluminum (Al) wire, power ribbon, and heavy Copper (Cu) wire applications. It supports a wide array of high-power devices, including automotive-grade HP1/DSC/HPD series, industrial-grade half-bridge modules, and laser modules.
Features
- Active Loop Control (ALC) for high-precision, consistent wire loop formation.
- Graphical Bondhead Setup (GBS) for intuitive operation and rapid product changeovers.
- Bond Process Monitoring (BPM) for online, real-time quality control.
- Dedicated space for integrated magazine loading/unloading systems to effortlessly fit into automated mass production lines.