Procurement of IGBT Housings & Power Module Cases (Open-Tool & Prototype Support)
At Hi-Fi Crew, we provide a wide range of high-quality resin housings (cases) for power semiconductors, including IGBTs and SiC power modules, catering to everything from mass production to low-volume development and prototyping.
💡 Two Solutions to Minimize Initial Costs
Are high initial tooling costs for resin housings a major bottleneck in your power module development or small-lot production? We offer optimal procurement solutions tailored to your development phase and budget.
- Moldless Prototyping & Low-Volume Delivery 【Accelerate Development Speed】 For ultra-low-volume prototypes (starting from a single piece), we can deliver components using machining or specialized manufacturing methods without creating a mold. This flexibly meets the needs of designers and developers who want to evaluate form, fit, or thermal resistance at an early stage.
- Utilization of Open Tools / Public Molds 【Significant Cost Reduction】 By leveraging a vast range of open tools (public molds) owned by our partner molding manufacturers, you can source standard-shaped IGBT housings with short lead times and low costs, completely eliminating the need for expensive new custom molds.
🛠️ Specifications & Material Capabilities
We select and mold the ideal resin materials for power semiconductors that demand high thermal resistance, dimensional stability, and excellent insulation properties.
Insert Molding & Complex Assemblies: We support insert molding and integrated molding for copper pins, press-fit pins, and sleeves. We also offer solutions ranging from single components to complete sets (including insert terminals, covers, and base plates).
Key Materials: PPS (Polyphenylene Sulfide), PBT (Polybutylene Terephthalate) glass-fiber reinforced grades, and various flame-retardant grades (UL94 V-0 compliant).
