We offer a wide range of mold cleaning sheets and mold release sheets (release films) for semiconductor packaging. These high-quality consumables are designed to optimize mold maintenance efficiency and maximize yield in power module encapsulation processes.
- Mold Cleaning Sheets: Exceptional adhesion and cleaning power to swiftly remove residual resin and gas deposits without damaging precision molds.
- Mold Release Sheets (Release): Outstanding thermal resistance and flexibility, ensuring smooth and flawless release even for complex package geometries.
We flexibly support everything from small prototyping test rolls to stable mass-production supply chains.