Application
Primarily designed for wedge bonding of power semiconductor devices, supporting heavy Aluminum (Al) wire and power ribbon applications.
Target Packages: TO252 / TO220 / TO247 / PDFN
Features
- Fully automated material handling for high throughput.
- Integrated pull testing and ALC (Automatic Loop Control) inspection.
- BPM (Bonding Process Monitoring) for online, real-time quality control.
- Low-resistance wire feed detection ensuring stable loop formation.