High-performance KGD (Known Good Die) test handler equipment. Please contact us for details.
Enclosed Chuck Structure: Fully sealed chuck with nitrogen (N2) purge protection and high-voltage arc prevention.
Automated die pickup, handling, testing, and unloading.
Supports various loading and unloading formats, including wafers, waffle packs, and more.
Each test station is individually configurable, including dedicated reject stations.
Supports a wide range of functional testing, including dynamic, static, and avalanche testing to ensure reliability in mass production lines.
Supports serial and parallel testing across 4 stations, enabling independent temperature control and distinct test configurations per station.
UPH (Throughput): 1,000 units/hour (calculated based on 4 test benches with continuous measurement and a 1-second test time).
Alignment Accuracy (Placement Accuracy): $\le\pm30\mu\text{m}$
Wide Temperature Range: Supports high-temperature testing from ambient up to $200^\circ\text{C}$.