OUR SERVICES

Hi-Fi Crew
Power Device Solutions

Empowering the Future of Power Semiconductors: Reliable Sourcing & Turnkey Solutions.
Hi-Fi Crew is a specialized trading company providing a comprehensive portfolio of power semiconductor materials, packaging components, backend materials, and advanced manufacturing/testing equipment. We seamlessly support your journey from initial rapid prototyping to high-volume mass production, ensuring short lead times and a highly resilient global supply chain.

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AMB substrates and IGBT power module materials - Hi-Fi Crew

About Hi-Fi Crew 

Hi-Fi Crew is a specialized trading company handling substrates, materials, and equipment for the power device industry. As the exclusive distributor of Winspower, we supply high-quality Si3N4 and AlN AMB substrates that meet the demands of customers seeking high reliability and performance. These substrates offer excellent thermal conductivity and insulation properties, meeting the advanced requirements of SiC power modules and next-generation semiconductor manufacturing. We also offer a wide range of materials, such as lead frames and resins, and equipment, including wire bonders, required throughout the power device manufacturing process, supporting everything from specification selection to procurement as a one-stop partner.

Product lineup

AMB/DBC Substrate

High thermal conductivity Si3N4 & AlN substrates

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Materials for Semicon

Lead frames, molding resins & release sheets

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Power module

Copper & press-fit pins, housings for IGBT assembly

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Manufacturing Machine

Wedge bonders, inspection & KGD test handlers

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Why Choose Hi-Fi Crew?

  • 01. Seamless Scaling from Prototyping to Mass Production
    We flexibly handle your needs across all stages—from rapid, toolless small-lot prototyping for R&D to secure, high-volume continuous supply chains for full-scale mass production lines.
  • 02. Cost-Optimized Sourcing via Open-Tooling Solutions
    By leveraging public molds (open tooling) for power module housings, we significantly eliminate your upfront capital expenditure on initial molds. We deliver highly cost-effective, integrated component kits (Housing + Pins + Heat Sink) tailored to your package design.
  • 03. Expert Engineering Support & Alternative Sourcing
    From technical specification selection for high-dissipation AMB substrates (Si3N4/AlN) to integrating automated backend encapsulation and inspection lines, our deep industry expertise guarantees the optimal solution for your pipeline.
  • Notice

    We are constantly receiving new stock. Please feel free to contact us if you require a quote.