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AMB Substrate
Material
Lead Frame
Semiconductor resin (molding, cleaning, release)
Cleaning rubber sheets, wax rubber sheets
Lead Frame Magazine
Power Module Materials
Power Module Housing
Cu PIN, Press fit PIN, Sleeve for IGBT
PIN FIN HEATSINK
Machine
Hybrid Wedge Bonder
Aluminum Wire Bonder
Hybrid AOI Machine
KGD Test Handler
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Semiconductor resin (molding, cleaning, release)
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Semiconductor resin (molding, cleaning, release)
We offer a variety of resins for IC, discrete, and power products.
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HOME
Item
AMB Substrate
Material
Lead Frame
Semiconductor resin (molding, cleaning, release)
Cleaning rubber sheets, wax rubber sheets
Lead Frame Magazine
Power Module Materials
Power Module Housing
Cu PIN, Press fit PIN, Sleeve for IGBT
PIN FIN HEATSINK
Machine
Hybrid Wedge Bonder
Aluminum Wire Bonder
Hybrid AOI Machine
KGD Test Handler
About Us
Contact Us
English
日本語
