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Hi-Fi Crew LLC.
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    • AMB Substrate
    • Material
      • Lead Frame
      • Semiconductor resin (molding, cleaning, release)
      • Cleaning rubber sheets, wax rubber sheets
      • Lead Frame Magazine
    • Power Module Materials
      • Power Module Housing
      • Cu PIN, Press fit PIN, Sleeve for IGBT
      • PIN FIN HEATSINK
    • Machine
      • Hybrid Wedge Bonder
      • Aluminum Wire Bonder
      • Hybrid AOI Machine
      • KGD Test Handler
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AMB Substrate

High voltage resistance and high heat dissipation. Small lot and prototype consultation available. [See details]

Materials for semiconductors

Resin, lead frame alternative proposals [See details]

Materials for IGBT power module

Resin, lead frame, IGBT material alternative proposals [See details]

Various manufacturing equipment

→Evaluation and introduction of various manufacturing equipment for production lines are available. [See details]

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Hi-Fi Crew LLC.

1-10-25, Yoshimatsu, Dazaifu, Fukuoka JAPAN 8180138

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MENU
  • HOME
  • Item
    • AMB Substrate
    • Material
      • Lead Frame
      • Semiconductor resin (molding, cleaning, release)
      • Cleaning rubber sheets, wax rubber sheets
      • Lead Frame Magazine
    • Power Module Materials
      • Power Module Housing
      • Cu PIN, Press fit PIN, Sleeve for IGBT
      • PIN FIN HEATSINK
    • Machine
      • Hybrid Wedge Bonder
      • Aluminum Wire Bonder
      • Hybrid AOI Machine
      • KGD Test Handler
  • About Us
  • Contact Us
  • English
  • 日本語