Application
Mainly designed for the wedge bonding process and ideal for thick Al wire, Power ribbon and thick Cu wire applications.
Support a variety of products such as automotive-grade HP1/DSC/HPD series, industrial grade half-bridge products and laser modules.
Function
- lActive Loop Control (ALC)
- lGraphical Bond head Setup (GBS)
- lBond Process Monitor (BPM)
- lSpace for magazine loading/unloading reserved