Application
Hybrid AOI Machine is mainly applied to the appearance inspection of power semiconductor modules, IPMs, substrates and AMB products, and makes it possible to measure the dimensions of die, wire, bond, DBC, Pin and detect their defects.
Function
- lFully automatic tray loading and unloading (programmable)
- lEquipped with 2D+3D cameras
- lAuto workholder adjustment
- lInline NG manual re-inspection platform
- lModule QR code scanner (optional)