AMB Substrate Technology
AMB Substrate
Lineup
Maximizing the thermal performance of SiC/GaN power devices through Active Metal Brazing (AMB) technology with Si₃N₄ and AlN ceramics. Based on your substrate drawings, we help you select the optimal substrate for your budget.
Product Lineup
Product Lineup
Power-S
≥40
W/m·K · Si₃N₄
Al₂O₃-DBC Alternative
Low-cost, high-volume grade. Ideal replacement for alumina DBC substrates.
WSP65
65
W/m·K · Si₃N₄
ZTA-DBC Alternative
World-exclusive grade. Featured at PCIM Europe 2024.
WSP90
90
W/m·K · Si₃N₄
Cost-Efficient Grade
Standard grade for SiC power modules. Proven in mass production.
WSP130
130
W/m·K · Si₃N₄
Next-Gen Ultra High Thermal
Highest thermal conductivity and reliability. Ideal for next-gen SiC modules.
★ In Development
WSP150
150
W/m·K · Si₃N₄
Next-Gen Flagship
Ultimate thermal performance grade. Currently in development. Contact us for details.
Specification Matrix
Substrate Specification Matrix
GradeSubstrate MaterialThermal ConductivityPositioning
Power-S
Si₃N₄ · AMB
Silicon Nitride · Active Metal Brazing
≥40W/m·K
Al₂O₃-DBC Alternative · Low Cost / High Volume
WSP65
Si₃N₄ · AMB
Silicon Nitride · Active Metal Brazing
65W/m·K
Upgrade from ZTA/DBC
WSP90
Si₃N₄ · AMB
Silicon Nitride · Active Metal Brazing
90W/m·K
Standard for SiC Modules
WSP130
Si₃N₄ · AMB
Silicon Nitride · Active Metal Brazing
130W/m·K
Next-Gen Ultra High Thermal · High Reliability
★
WSP150 (150 W/m·K) currently in development — Highest thermal conductivity grade. Contact us for details.
Ceramic Material Properties
Ceramic Material Comparison
Al₂O₃
Flexural Strength400 MPa
Fracture Toughness3.0
Thermal Conductivity24 W/mK
Thermal Expansion7.0
ZTA
Flexural Strength650 MPa
Fracture Toughness3.5
Thermal Conductivity28 W/mK
Thermal Expansion7.0
AlN
Flexural Strength450 MPa
Fracture Toughness3.0
Thermal Conductivity170 W/mK
Thermal Expansion4.6
Si₃N₄
★ Winspower
Flexural Strength700 MPa
Fracture Toughness6.5
Thermal Conductivity90 W/mK
Thermal Expansion2.6
★ Winspower specializes in Si₃N₄ AMB substrates. High fracture toughness, high flexural strength, and low CTE — ideal for EV inverters.
Manufacturing Process
Manufacturing Process
01
Materials
Ceramic
Cu Foil
Cu Foil
›
02
Paste Printing
Active Metal
Paste
Paste
›
03
Vacuum Brazing
High-Temp
Furnace
Furnace
›
04
Etching
Circuit
Pattern
Pattern
›
05
Plating
Ag / Ni / Au
Available
Available
›
06
Inspection
AOI / Insulation
Test
Test
▶ Fully in-house production — from raw materials to final visual inspection
Strategic Partner
Winspower × Hi-Fi Crew
As the authorized distributor of Nantong Winspower Semiconductor Technology, Hi-Fi Crew works with Winspower — with proven expertise in molding processes — to help you select the best substrate for your needs and budget.